Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-71V016SA10BF8 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 2,000 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tape & Reel (TR) | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Asynchronous | |
| Memory Size | 1M (64K x 16) | |
| Speed | 10ns | |
| Interface | Parallel | |
| Voltage - Supply | 3.15 V ~ 3.6 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 48-LFBGA | |
| Supplier Device Package | 48-CABGA (7x7) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 71V016SA10BF8 | |
| Related Links | 71V016, 71V016SA10BF8 Datasheet, Integrated Device Technology (IDT) Distributor | |
![]() | 9T06031A68R0BAHFT | RES SMD 68 OHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | LM3704YCMM-308/NOPB | IC MPU SUPERVISOR 3.08V 10MSOP | datasheet.pdf | |
![]() | MCW0406MD5601BP100 | RES SMD 5.6K OHM 1/4W 0604 WIDE | datasheet.pdf | |
![]() | EP2AGZ350HF40I3N | IC FPGA 734 I/O 1517FBGA | datasheet.pdf | |
![]() | ATS-04B-106-C2-R1 | HEATSINK 45X40X12.7MM XCUT T766 | datasheet.pdf | |
![]() | ATS-16E-144-C1-R0 | HEATSINK 30X30X25MM L-TAB | datasheet.pdf | |
![]() | T38137-06-0 | Connector Barrier Block Strip 6 Circuit 0.375" (9.53mm) | datasheet.pdf | |
![]() | FHLM0200ZPA | FUSE HOLDER BLADE 10A IN LINE | datasheet.pdf | |
![]() | D38999/26FE99HN-LC | CONN HSG PLUG STRGHT 23POS PIN | datasheet.pdf | |
![]() | PT06CGPFA-14-15P | PT 15C 14#20 1#16 PIN PLUG | datasheet.pdf | |
![]() | SG3102E32-12S | ER 15C 10#16 5#12 SKT RECP BOX | datasheet.pdf | |
![]() | ADE7169ACPZF161 | Single-Phase Energy Measurement IC with 8052 MCU, RTC and LCD driver IC | datasheet.pdf |