Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-8.08.11 J-LINK/J-FLASH BUNDLE | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Design Resources | Development Tool Selector | |
| Standard Package | 1 | |
| Category | Programmers, Development Systems | |
| Family | In-Circuit Programmers, Emulators, and Debuggers | |
| Series | - | |
| Type | Emulator | |
| For Use With/Related Products | ARM MCUs | |
| Contents | Emulator Board, Cables, Software and Documentation | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 8.08.11 J-LINK/J-FLASH BUNDLE | |
| Related Links | 8.08.11 J-LINK, 8.08.11 J-LINK/J-FLASH BUNDLE Datasheet, Segger Microcontroller Systems Distributor | |
![]() | RCC26DRYN-S734 | CONN EDGECARD 52POS DIP .100 SLD | datasheet.pdf | |
![]() | 71991-303LF | CONN RCPT 6POS .100 DL STR PCB | datasheet.pdf | |
![]() | PCA9673DB,118 | IC I/O EXPANDER I2C 16B 24SSOP | datasheet.pdf | |
![]() | LTC4307IDD-1#TRPBF | IC ACCELERATOR I2C HOTSWAP 8DFN | datasheet.pdf | |
![]() | 1180-01-10A | CIR BRKR THRM 10A 250VAC 72VDC | datasheet.pdf | |
![]() | R101-244-000 | BOX ALUM GRAY 18.9"L X 9.45"W | datasheet.pdf | |
![]() | DCMF27W2S | D-Sub Connector Receptacle, Female Sockets 27 (25 + 2 Coax or Power) Position Panel Mount Solder Cup | datasheet.pdf | |
![]() | ATS-07H-196-C2-R0 | HEATSINK 45X45X6MM XCUT T766 | datasheet.pdf | |
![]() | MA-506 11.9550M-W0: ROHS | CRYSTAL 11.9550 MHZ 12.0PF SMD | datasheet.pdf | |
![]() | 505PHC600K | CAP FILM 5UF 10% 600V AXIAL | datasheet.pdf | |
![]() | CTVS07RF-13-8PC-LC | CTV 8C 8#20 PIN J/N RECP | datasheet.pdf | |
![]() | GTC02R16-10SW | GT 3C 3#12 SKT RECP BOX | datasheet.pdf |