Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-801-87-020-20-002101 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| RoHS Information | RoHS Declaration | |
| Standard Package | 400 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular Connectors - Headers, Receptacles, Female Sockets | |
| Series | 801 | |
| Packaging | Bulk | |
| Connector Type | Socket | |
| Contact Type | Female Socket | |
| Number of Positions | 20 | |
| Number of Positions Loaded | All | |
| Pitch | 0.100" (2.54mm) | |
| Number of Rows | 1 | |
| Row Spacing | - | |
| Mounting Type | Through Hole, Right Angle | |
| Termination | Solder | |
| Fastening Type | - | |
| Features | - | |
| Contact Finish | Gold | |
| Contact Finish Thickness | Flash | |
| Color | Black | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 801-87-020-20-002101 | |
| Related Links | 801-87-020, 801-87-020-20-002101 Datasheet, Preci-Dip Distributor | |
![]() | 0190190004 | Connector Quick Connect Receptacle 18-22 AWG 0.110" (2.79mm) Crimp | datasheet.pdf | |
![]() | NJM79M15FA | IC REG LDO -15V 0.5A TO220F | datasheet.pdf | |
![]() | 1422F24 | CABINET STEEL 24.7X72.1X72.1 GR | datasheet.pdf | |
![]() | RLR32C8202GRR64 | RES 82K OHM 2% 1W AXIAL | datasheet.pdf | |
![]() | LFECP20E-3F484C | IC FPGA 360 I/O 484FPBGA | datasheet.pdf | |
![]() | TFR12PH10 | CONN PLUG HSG 12POS W/ SR | datasheet.pdf | |
![]() | RBC35HEYH | CONN EDGECARD .100" 35POS THRUHL | datasheet.pdf | |
![]() | 151-14601 | HOSE CLIPS W/STDMNT .98" | datasheet.pdf | |
![]() | ATS-05E-184-C2-R0 | HEATSINK 40X40X25MM R-TAB T766 | datasheet.pdf | |
![]() | 5023520210 | CONN HEADER 2POS 2MM R/A SMD | datasheet.pdf | |
![]() | SIT3809AI-2-25EG | OSC MEMS PROG 2.5V SMD | datasheet.pdf | |
![]() | EP7309-IB-C | HIGH PERFORMANCE LOW POWER SYSTEM ON CHIP ENHANCED DIGITAL AUDIO INTERFACE IC | datasheet.pdf |