Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-8080-1G3 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 400 | |
| Category | Connectors, Interconnects | |
| Family | Sockets for ICs, Transistors | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 8080-1G3 | |
| Related Links | 8080, 8080-1G3 Datasheet, TE Connectivity AMP Connectors Distributor | |
![]() | EEE-0JA152P | CAP ALUM 1500UF 20% 6.3V SMD | datasheet.pdf | |
![]() | LTC7541AKN | IC CMOS D/A CONV 12BIT 18-DIP | datasheet.pdf | |
![]() | VS-ST300C12C0 | SCR PHASE CONT 1200V 650A E-PUK | datasheet.pdf | |
![]() | RG1608P-4991-B-T1 | RES SMD 4.99KOHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | XIO2001ZGU | IC PCI-EXPRESS/BUS BRIDGE 169BGA | datasheet.pdf | |
![]() | SB560A-E3/73 | DIODE SCHOTTKY 60V 5A DO201AD | datasheet.pdf | |
![]() | LFXP2-17E-H-EVN | BOARD EVAL LATTICEXP2 ADV | datasheet.pdf | |
![]() | RER75F33R2RC02 | RES CHAS MNT 33.2 OHM 1% 30W | datasheet.pdf | |
![]() | ATS-12D-130-C2-R0 | HEATSINK 60X60X15MM XCUT T766 | datasheet.pdf | |
![]() | MDM-51PH009P | MICRO 51C P 24" YEL JACKP | datasheet.pdf | |
![]() | MS3100E24-28PF187 | CONN RCPT 24POS WALL MNT PIN | datasheet.pdf | |
![]() | MS3108A24-7P-RES | ER 16C 14#16 2#12 PIN PLUG | datasheet.pdf |