Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-811-22-012-30-006101 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | Spring-Loaded Connectors | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular Connectors - Spring Loaded | |
| Series | 811 | |
| Packaging | Tube | |
| Connector Type | Piston | |
| Number of Contacts | 12 | |
| Pitch | 0.100" (2.54mm) | |
| Number of Rows | 1 | |
| Row Spacing | - | |
| Mounting Type | Surface Mount | |
| Material | Copper Alloy | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 20µin (0.51µm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 811-22-012-30-006101 | |
| Related Links | 811-22-012, 811-22-012-30-006101 Datasheet, Mill-Max Distributor | |
![]() | MCR18EZHJ330 | RES SMD 33 OHM 5% 1/4W 1206 | datasheet.pdf | |
![]() | EGM15DTBT-S189 | CONN EDGECARD 30POS R/A .156 SLD | datasheet.pdf | |
![]() | NCV1117DT33T5G | IC REG LDO 3.3V 1A DPAK | datasheet.pdf | |
![]() | PIC16F526T-I/ST | IC MCU 8BIT 1.5KB FLASH 14TSSOP | datasheet.pdf | |
![]() | WD2RE01GX809-667G-PQ | MODULE DDR2-667 1GB 240-DIMM | datasheet.pdf | |
![]() | CR6241-250-50 | TRANSDCR AC 4-20MADC OUT 3PHASE | datasheet.pdf | |
![]() | PIC16LF1519-I/MV | IC MCU 8BIT 28KB FLASH 40QFN | datasheet.pdf | |
![]() | 192923-6010 | CONN RCPT HSG 3POS PNL MNT | datasheet.pdf | |
![]() | 0014563184 | CONN IDC 18POS 2.54MM 24AWG GOLD | datasheet.pdf | |
![]() | 3M2AM3-C-TNG | EM AWARE TNG ESD MONITOR KIT | datasheet.pdf | |
![]() | 0702871184 | CONN HEADER BKWY DL GOLD 78POS | datasheet.pdf | |
![]() | ATS-11B-158-C2-R0 | HEATSINK 40X40X35MM L-TAB T766 | datasheet.pdf |