Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-814-22-012-30-009101 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Spring-Loaded Connectors | |
| Featured Product | Spring-Loaded Connectors | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular Connectors - Spring Loaded | |
| Series | 814 | |
| Packaging | Tube | |
| Connector Type | Piston | |
| Number of Contacts | 12 | |
| Pitch | 0.100" (2.54mm) | |
| Number of Rows | 2 | |
| Row Spacing | 0.100" (2.54mm) | |
| Mounting Type | Surface Mount | |
| Material | Copper Alloy | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 20µin (0.51µm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 814-22-012-30-009101 | |
| Related Links | 814-22-012, 814-22-012-30-009101 Datasheet, Mill-Max Distributor | |
![]() | AT49BV002T-12TI | IC FLASH 2MBIT 120NS 32TSOP | datasheet.pdf | |
![]() | PDB-C136 | PHOTODIODE BLUE 1.55MM SQ T1 3/4 | datasheet.pdf | |
![]() | RG1608P-8660-W-T5 | RES SMD 866 OHM 0.05% 1/10W 0603 | datasheet.pdf | |
![]() | MCP4141-104E/MF | IC POT DGTL SNGL 100K SPI 8DFN | datasheet.pdf | |
![]() | 4-1879696-8 | RES 412K OHM 1/4W 0.1% AXIAL | datasheet.pdf | |
| 823257-000 | BOOT MOLDED POLY FLEX | datasheet.pdf | ||
![]() | XC6SLX150-N3FGG900I | IC FPGA 576 I/O 900FBGA | datasheet.pdf | |
![]() | ECW-H10153RHV | CAP FILM 0.015UF 3% 1KVDC RADIAL | datasheet.pdf | |
![]() | CAY17-433JALF | RES ARRAY 8 RES 43K OHM 1206 | datasheet.pdf | |
| EC0923-000 | 6173902 | datasheet.pdf | ||
![]() | MBB02070C5623FC100 | RES 562K OHM 0.6W 1% AXIAL | datasheet.pdf | |
![]() | MKP1847615314Y2 | CAP FILM 15UF 5% 310VAC | datasheet.pdf |