Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-85-PGM11007-11H | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Sockets for ICs, Transistors | |
Series | PGM | |
Packaging | Bulk | |
Type | PGA | |
Number of Positions or Pins (Grid) | - | |
Pitch - Mating | 0.100" (2.54mm) | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | 10µin (0.25µm) | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | - | |
Termination | Solder | |
Pitch - Post | 0.100" (2.54mm) | |
Contact Finish - Post | Gold | |
Contact Finish Thickness - Post | 10µin (0.25µm) | |
Contact Material - Post | Brass | |
Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled | |
Operating Temperature | -55°C ~ 125°C | |
Termination Post Length | 0.165" (4.19mm) | |
Material Flammability Rating | UL94 V-0 | |
Current Rating | 3A | |
Contact Resistance | - | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 85-PGM11007-11H | |
Related Links | 85-PGM1, 85-PGM11007-11H Datasheet, Aries Electronics, Inc. Distributor |
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