Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-9350004-397 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Other Related Documents | TEC Inspection Guide | |
| Mfg Application Notes | Thermoelectric Handbook | |
| Product Training Modules | Thermoelectric Module Product Line | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Thermoelectric, Peltier Modules | |
| Series | Multistage | |
| Outline L x W x H | 30.00mm x 30.00mm x 10.39mm | |
| Qmax @ Th | 7.5W @ 25°W | |
| Delta Tmax @ Th | 100°C @ 25°C | |
| Current - Max | 3.9A | |
| Voltage - Max | 8.1V | |
| Resistance (Ohms) | - | |
| Operating Temperature | 80°C | |
| Features | Non-Sealed | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 9350004-397 | |
| Related Links | 93500, 9350004-397 Datasheet, Laird Technologies - Engineered Thermal Solutions Distributor | |
![]() | 74VCX38MX | IC GATE NAND 4CH 2-INP 14-SOIC | datasheet.pdf | |
![]() | DEMO9S08AW60E | DEMO BOARD FOR MC9S08AW60 | datasheet.pdf | |
![]() | RCC43DRYI | CONN EDGECARD 86POS DIP .100 SLD | datasheet.pdf | |
![]() | 7130SA35TF8 | IC SRAM 8KBIT 35NS 64TQFP | datasheet.pdf | |
![]() | MS27466T13F35PB-LC | CONN HSG RCPT FLANGE 22POS PIN | datasheet.pdf | |
![]() | 0362.500V | FUSE GLASS 500MA 32VAC/VDC 8AG | datasheet.pdf | |
![]() | CMF5514K000BHEB | RES 14K OHM 1/2W 0.1% AXIAL | datasheet.pdf | |
![]() | MAL203858229E3 | CAP ALUM 22UF 20% 63V RADIAL | datasheet.pdf | |
![]() | DMN30H4D0LFDE-13 | MOSFET N-CH 300V 0.55A 6UDFN | datasheet.pdf | |
![]() | 20020111-G121A01LF | TERM BLOCK | datasheet.pdf | |
![]() | CPL-5213-20-SMA-79 | COUPLER 20 DB 2.6-5.2GHZ | datasheet.pdf | |
![]() | CTV06RW-23-54PA-LC | CTV 53C 40#22D 9#16 4#12 PIN | datasheet.pdf |