Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-93LC66A/ST | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Assembly/Origin | 8L SOIJ Package/Plating 31/Jul/2013 Qualification Report Revsion 15/Oct/2014 | |
| PCN Packaging | Label and Packing Changes 23/Sep/2015 | |
| Standard Package | 100 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tube | |
| Format - Memory | EEPROMs - Serial | |
| Memory Type | EEPROM | |
| Memory Size | 4K (512 x 8) | |
| Speed | 2MHz | |
| Interface | Microwire, 3-Wire Serial | |
| Voltage - Supply | 2.5 V ~ 5.5 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 8-TSSOP (0.173", 4.40mm Width) | |
| Supplier Device Package | 8-TSSOP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 93LC66A/ST | |
| Related Links | 93LC6, 93LC66A/ST Datasheet, Microchip Technology Distributor | |
![]() | BLM21PG300SN1D | FERRITE CHIP 30 OHM 0805 | datasheet.pdf | |
![]() | HMM24DRKH-S13 | CONN EDGECARD 48POS .156 EXTEND | datasheet.pdf | |
![]() | RC0201JR-0711RL | RES SMD 11 OHM 5% 1/20W 0201 | datasheet.pdf | |
![]() | RNC50J1270BSRE6 | RES 127 OHM 1/10W .1% AXIAL | datasheet.pdf | |
![]() | RWR81S6200FPB12 | RES 620 OHM 1W 1% WW AXIAL | datasheet.pdf | |
![]() | P13-2123 | 1.27MM CENTER TWO PART PROBE | datasheet.pdf | |
![]() | ATS-03G-06-C3-R0 | HEATSINK 45X45X10MM XCUT T412 | datasheet.pdf | |
![]() | ATS-16G-140-C3-R0 | HEATSINK 25X25X25MM L-TAB T412 | datasheet.pdf | |
![]() | ATS-02D-189-C3-R0 | HEATSINK 45X45X20MM R-TAB T412 | datasheet.pdf | |
![]() | 3007W2SAM99A20X | 7W2 F S/C M3 | datasheet.pdf | |
![]() | KLKD008.H | FUSE CERAMIC 8A 600VAC/VDC 5AG | datasheet.pdf | |
![]() | 22759/35-26-8 | CABLE STRANDED | datasheet.pdf |