Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-97-3106B22-20PW-417 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Circular Connectors | |
Series | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 97-3106B22-20PW-417 | |
Related Links | 97-3106B2, 97-3106B22-20PW-417 Datasheet, Amphenol Industrial Distributor |
![]() | UPW1V102MHH | CAP ALUM 1000UF 20% 35V RADIAL | datasheet.pdf | |
![]() | GEC30SFBN-M30 | CONN HEADER 30PS .100 SINGLE SMD | datasheet.pdf | |
![]() | MPSA42ZL1G | TRANS NPN 300V 0.5A TO-92 | datasheet.pdf | |
![]() | CAT1025ZI-42-GT3 | IC SUPERVISOR CPU 2K EEPR 8MSOP | datasheet.pdf | |
![]() | AOB10N60L | MOSFET N-CH 600V 10A TO263 | datasheet.pdf | |
![]() | 0982670328 | 1MM JMPR LGT 229 TYPE D 16POS | datasheet.pdf | |
![]() | S0603-56NJ1 | FIXED IND 56NH 600MA 340 MOHM | datasheet.pdf | |
![]() | DSC1101DL2-013.5600T | OSC MEMS 13.56MHZ CMOS SMD | datasheet.pdf | |
![]() | SIT9003AI-1-25DO | OSC MEMS PROG 2.5X2.0MM 2.5V | datasheet.pdf | |
![]() | XUF216-256-FB236-I20 | IC MCU 256KB RAM 236FBGA | datasheet.pdf | |
![]() | MKP383182063JDM2B0 | CAP FILM 630VDC 0.00082UF RADIAL | datasheet.pdf | |
![]() | OP-37AZ | LOW NOISE, PRECISION, HIGH SPEED OPERATIONAL AMPLIFIER(AVCL>=5) IC | datasheet.pdf |