Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-9FG1901HKLF | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire 30/Jul/2013 Assembly Lot Number Scheme 12/Oct/2013 | |
| PCN Assembly/Origin | VFQFPN-72 Alternate Assembly 19/Aug/2013 Alternate Assembly Site 04/Dec/2013 Alternate Assembly Location 17/Feb/2014 TSSOP/VFQFPN Assembly Site/Part Marking Chg 13/Nov/2015 | |
| Standard Package | 168 | |
| Category | Integrated Circuits (ICs) | |
| Family | Clock/Timing - Application Specific | |
| Series | - | |
| Packaging | Tray | |
| PLL | Yes | |
| Main Purpose | Memory, DIMM, PCI Express (PCIe) | |
| Input | HCSL | |
| Output | HCSL | |
| Number of Circuits | 1 | |
| Ratio - Input:Output | 1:19 | |
| Differential - Input:Output | Yes/Yes | |
| Frequency - Max | 400MHz | |
| Voltage - Supply | 3.135 V ~ 3.465 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 72-VFQFN Exposed Pad | |
| Supplier Device Package | 72-VFQFPN (10x10) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 9FG1901HKLF | |
| Related Links | 9FG19, 9FG1901HKLF Datasheet, Integrated Device Technology (IDT) Distributor | |
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