Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-9FG830AGLF | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Assembly Lot Number Scheme 12/Oct/2013 Copper Bond Wire 16/Oct/2014 | |
| PCN Assembly/Origin | TSSOP/VFQFPN Assembly Site/Part Marking Chg 13/Nov/2015 | |
| Standard Package | 39 | |
| Category | Integrated Circuits (ICs) | |
| Family | Clock/Timing - Application Specific | |
| Series | - | |
| Packaging | Tube | |
| PLL | Yes | |
| Main Purpose | Intel QPI, PCI Express (PCIe) | |
| Input | Clock, Crystal | |
| Output | HCSL, LVTTL | |
| Number of Circuits | 1 | |
| Ratio - Input:Output | 1:9 | |
| Differential - Input:Output | No/Yes | |
| Frequency - Max | 400MHz | |
| Voltage - Supply | 3.135 V ~ 3.465 V | |
| Operating Temperature | 0°C ~ 70°C | |
| Mounting Type | Surface Mount | |
| Package / Case | 48-TFSOP (0.240", 6.10mm Width) | |
| Supplier Device Package | 48-TSSOP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 9FG830AGLF | |
| Related Links | 9FG83, 9FG830AGLF Datasheet, Integrated Device Technology (IDT) Distributor | |
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