Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A14162-15 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Tflex™ 200 V0 | |
| Usage | Sheet | |
| Shape | Square | |
| Outline | 228.60mm x 228.60mm | |
| Thickness | 0.100" (2.54mm) | |
| Material | Silicone Elastomer | |
| Adhesive | Tacky - Both Sides | |
| Backing, Carrier | - | |
| Color | Gray | |
| Thermal Resistivity | 2.93°C/W | |
| Thermal Conductivity | 1.1 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A14162-15 | |
| Related Links | A141, A14162-15 Datasheet, Laird Technologies - Engineered Thermal Solutions Distributor | |
![]() | EMVE160ADA330MF55G | CAP ALUM 33UF 20% 16V SMD | datasheet.pdf | |
![]() | MCR01MZPF2211 | RES SMD 2.21K OHM 1% 1/16W 0402 | datasheet.pdf | |
![]() | RT0603CRE0730K0L | RES SMD 30K OHM 0.25% 1/10W 0603 | datasheet.pdf | |
![]() | DSPIC33FJ128GP708T-I/PT | IC DSC 16BIT 128KB FLASH 80TQFP | datasheet.pdf | |
![]() | GMM10DRMT-S288 | CONN EDGECARD 20POS .156 EXTEND | datasheet.pdf | |
![]() | 381LX471M080H202 | CAP ALUM 470UF 20% 80V SNAP | datasheet.pdf | |
![]() | ADG408BRZ-REEL7 | IC MULTIPLEXER 8X1 16SOIC | datasheet.pdf | |
![]() | ADC1413D105HN/C1,5 | ADC 14BIT DUAL 105MSPS 56HVQFN | datasheet.pdf | |
![]() | MCU08050D1204BP100 | RES SMD 1.2M OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | MCW0406MD8259BP100 | RES SMD 82.5 OHM 1/4W 0604 WIDE | datasheet.pdf | |
![]() | EKXJ201ELL151MU25S | CAP ALUM 150UF 20% 200V RADIAL | datasheet.pdf | |
![]() | C4SE00421-2 | CONNECTOR | datasheet.pdf |