Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A15324-03 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Tflex™ 300 | |
| Usage | Sheet | |
| Shape | Square | |
| Outline | 228.60mm x 228.60mm | |
| Thickness | 0.040" (1.02mm) | |
| Material | Silicone Elastomer | |
| Adhesive | - | |
| Backing, Carrier | - | |
| Color | Green | |
| Thermal Resistivity | 2.11°C/W | |
| Thermal Conductivity | 1.2 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A15324-03 | |
| Related Links | A153, A15324-03 Datasheet, Laird Technologies - Engineered Thermal Solutions Distributor | |
![]() | MIC5321-SFYMT-TR | IC REG LDO 3.3V/1.5V 0.15A 6TMLF | datasheet.pdf | |
![]() | PLT1206Z3970LBTS | RES SMD 397 OHM 0.01% 0.4W 1206 | datasheet.pdf | |
![]() | SPI-324P-O4-N1 | IP PHY LAYER BRIDGE SPI3-4 ORCA4 | datasheet.pdf | |
![]() | RWR81S3160FSBSL | RES 316 OHM 1W 1% WW AXIAL | datasheet.pdf | |
![]() | E5GN-C103T-FLK AC100-240 | CONTROL TEMP 100-240V PANEL MT | datasheet.pdf | |
![]() | IUGN6-34901-1 | CIRCUIT BREAKER MAG-HYDR TOGGLE | datasheet.pdf | |
![]() | MTEDCBR004SAJ-1N2 | EMBEDDED USB | datasheet.pdf | |
![]() | 8N4QV01KG-0157CDI | IC OSC VCXO QD FREQ 10CLCC | datasheet.pdf | |
![]() | ACC22DTBS | CONN EDGECARD 44POS .100" | datasheet.pdf | |
![]() | 30M6020-2D | MOTORIZED VRBLE TRANSF 280V 35A | datasheet.pdf | |
![]() | XCV812E-8FG900I | Virtex-E 1.8 V Extended Memory FPGA Field Programmable Gate Arrays IC | datasheet.pdf | |
![]() | XC4010D-3PQ160C | IC FPGA 160 I/O 208QFP | datasheet.pdf |