Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A15896-18 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Tflex™ 700 | |
| Usage | Sheet | |
| Shape | Square | |
| Outline | 228.60mm x 228.60mm | |
| Thickness | 0.180" (4.57mm) | |
| Material | Silicone | |
| Adhesive | Tacky - Both Sides | |
| Backing, Carrier | - | |
| Color | Gray | |
| Thermal Resistivity | - | |
| Thermal Conductivity | 5.0 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A15896-18 | |
| Related Links | A158, A15896-18 Datasheet, Laird Technologies - Engineered Thermal Solutions Distributor | |
![]() | LT1236CCS8-10 | IC VREF SERIES/SHUNT 10V 8SOIC | datasheet.pdf | |
![]() | GCC50DRYS-S734 | CONN EDGECARD 100PS DIP .100 SLD | datasheet.pdf | |
![]() | CRCW2010732RFKEFHP | RES SMD 732 OHM 1% 1W 2010 | datasheet.pdf | |
![]() | XC6SLX75-N3FGG676C | IC FPGA 408 I/O 676FBGA | datasheet.pdf | |
![]() | CAY16-151J4LF | RES ARRAY 4 RES 150 OHM 1206 | datasheet.pdf | |
![]() | OSTYK60603330 | Connector Barrier Block Strip 3 Circuit 0.394" (10.00mm) | datasheet.pdf | |
![]() | CJ1W-IA111 | INPUT MODULE 16 DIGITAL | datasheet.pdf | |
![]() | RN60C3790BB14 | RES 379 OHM 1/4W .1% AXIAL | datasheet.pdf | |
![]() | CGA3E3X5R1V684K080AB | CAP CER 0.68UF 35V X5R 0603 | datasheet.pdf | |
![]() | L17HTNBS3R1C | D-Sub Connector Receptacle, Female Sockets 25 Position Through Hole Solder | datasheet.pdf | |
![]() | CTVPS00RF-21-41PA-LC | CTV 41C 41#20 PIN RECP | datasheet.pdf | |
![]() | XCS30XL-5CS256I | Spartan and Spartan-XL Families FPGA Field Programmable Gate Arrays IC | datasheet.pdf |