Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A15973-08 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | Tflex™ 300 Series | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Tflex™ 300 | |
| Usage | Sheet | |
| Shape | Square | |
| Outline | 228.60mm x 228.60mm | |
| Thickness | 0.080" (2.03mm) | |
| Material | Silicone Elastomer | |
| Adhesive | - | |
| Backing, Carrier | - | |
| Color | Green | |
| Thermal Resistivity | 1.81°C/W | |
| Thermal Conductivity | 1.2 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A15973-08 | |
| Related Links | A159, A15973-08 Datasheet, Laird Technologies - Engineered Thermal Solutions Distributor | |
![]() | CWS-H08-STDED-UX | SOFTWARE CODEWARRIOR UPGRD HC08 | datasheet.pdf | |
| IRFP17N50L | MOSFET N-CH 500V 16A TO-247AC | datasheet.pdf | ||
![]() | 74HC03PW,118 | IC GATE NAND 4CH 2-INP 14-TSSOP | datasheet.pdf | |
![]() | TNPW0805453RBEEN | RES SMD 453 OHM 0.1% 1/8W 0805 | datasheet.pdf | |
![]() | A3PN250-Z1VQ100 | IC FPGA 68 I/O 100VQFP | datasheet.pdf | |
![]() | REC15-4815D/H3/M | DC/DC CONVERTER +/-15V 500MA 15W | datasheet.pdf | |
![]() | 813-S1-020-30-017191 | CONN SPRING LOAD 20POS DUAL SMD | datasheet.pdf | |
![]() | 0152670780 | PREMO-FLEX 1.00 JMPR LGT 203 TYP | datasheet.pdf | |
![]() | RF 1BV | DIODE GEN PURP 800V 600MA AXIAL | datasheet.pdf | |
![]() | ATS-15H-44-C2-R0 | HEATSINK 25X25X15MM L-TAB T766 | datasheet.pdf | |
![]() | VJ0805D7R5CXAAC | CAP CER 7.5PF 50V NP0 0805 | datasheet.pdf | |
![]() | 219-7MSJF | SWITCH DIP | datasheet.pdf |