Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A15973-22 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | Tflex™ 300 Series | |
| Standard Package | 1 | |
| Category | Fans, Thermal Management | |
| Family | Thermal - Pads, Sheets | |
| Series | Tflex™ 300 | |
| Usage | Sheet | |
| Shape | Square | |
| Outline | 228.60mm x 228.60mm | |
| Thickness | 0.020" (0.508mm) | |
| Material | Silicone Elastomer | |
| Adhesive | - | |
| Backing, Carrier | - | |
| Color | Green | |
| Thermal Resistivity | 0.84°C/W | |
| Thermal Conductivity | 1.2 W/m-K | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A15973-22 | |
| Related Links | A159, A15973-22 Datasheet, Laird Technologies - Engineered Thermal Solutions Distributor | |
![]() | MC33161P | IC MONITOR VOLTAGE UNIV 8DIP | datasheet.pdf | |
![]() | SY89545LMI | IC MUX 4:1 LVDS DIFF 3.3V 32MLF | datasheet.pdf | |
![]() | XC6SLX150T-N3FGG676C | IC FPGA 396 I/O 676FBGA | datasheet.pdf | |
![]() | D38999/26FJ4SE-LC | CONN HSG PLUG STRGHT 56POS SKT | datasheet.pdf | |
![]() | 37212000511 | FUSE BOARD MOUNT 2A 250VAC RAD | datasheet.pdf | |
![]() | MS3100R18-10SX | CONN RCPT 4POS WALL MNT W/SKTS | datasheet.pdf | |
![]() | 894-80-090-20-002101 | CONN HDR 90POS 2.54MM T/H R/A | datasheet.pdf | |
![]() | RCC60HEYH | CONN EDGECARD .100" 60POS THRUHL | datasheet.pdf | |
![]() | ATS-07H-206-C3-R0 | HEATSINK 60X60X10MM XCUT T412 | datasheet.pdf | |
![]() | DBMD13P3SVA191A197 | DBMD13P3SVA191A197 | datasheet.pdf | |
![]() | 240413-2 | SPACER | datasheet.pdf | |
![]() | AD7672LN05 | LC2MOS HIGH-SPEED 12-BIT ADC IC | datasheet.pdf |