Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-A2F200M3F-1PQ208 | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Other | SmartFusion Fixes 11/Mar/2015 | |
Standard Package | 24 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion® | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 256KB | |
MCU RAM | 64KB | |
Peripherals | DMA, POR, WDT | |
Connectivity | EBI/EMI, Ethernet, I²C, SPI, UART/USART | |
Speed | 100MHz | |
Primary Attributes | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 208-BFQFP | |
Supplier Device Package | 208-PQFP (28x28) | |
Number of I/O | MCU - 22, FPGA - 66 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | A2F200M3F-1PQ208 | |
Related Links | A2F200M3, A2F200M3F-1PQ208 Datasheet, Microsemi SoC Distributor |
![]() | OP497FS | IC OPAMP GP 500KHZ 16SOIC | datasheet.pdf | |
![]() | GBC55DRSD-S273 | CONN EDGECARD 110PS DIP .100 SLD | datasheet.pdf | |
![]() | VLMW3200-GS18 | LED WHITE 4SMD | datasheet.pdf | |
![]() | AGL400V5-FG256 | IC FPGA 178 I/O 256FBGA | datasheet.pdf | |
![]() | RNC55H5621FSRE6 | RES 5.62K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | G7J-4A-P AC50 | RELAY GEN PURPOSE 4PST 25A 50V | datasheet.pdf | |
![]() | MS3100E20-19S | CONN RCPT 3POS WALL MNT W/SKTS | datasheet.pdf | |
![]() | GBB24DYFD | CONN EDGECARD .050" 24POS SMD | datasheet.pdf | |
![]() | IH2424D | DC/DC CONVERTER +/-24V 2W | datasheet.pdf | |
![]() | VJ0805D270GXXAC | CAP CER 27PF 25V NP0 0805 | datasheet.pdf | |
![]() | 22759/43-16-9CS2348 | CABLE STRANDED | datasheet.pdf | |
![]() | CTV07RW-25-46A | CTV 46C MIXED PIN J/N RECP | datasheet.pdf |