Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-A2F500M3G-1FGG256M | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 90 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | SmartFusion® | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | ARM® Cortex®-M3 | |
MCU Flash | 512KB | |
MCU RAM | 64KB | |
Peripherals | DMA, POR, WDT | |
Connectivity | EBI/EMI, Ethernet, I²C, SPI, UART/USART | |
Speed | 100MHz | |
Primary Attributes | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | |
Operating Temperature | -55°C ~ 125°C | |
Package / Case | 256-LBGA | |
Supplier Device Package | 256-FBGA (17x17) | |
Number of I/O | MCU - 25, FPGA - 66 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | A2F500M3G-1FGG256M | |
Related Links | A2F500M3G, A2F500M3G-1FGG256M Datasheet, Microsemi SoC Distributor |
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