Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3P060-1FGG144I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 18432 | |
| Number of I/O | 96 | |
| Number of Gates | 60000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 144-LBGA | |
| Supplier Device Package | 144-FPBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3P060-1FGG144I | |
| Related Links | A3P060-, A3P060-1FGG144I Datasheet, Microsemi SoC Distributor | |
![]() | 1.5SMC43AT3 | TVS DIODE 36.8VWM 59.3VC SMC | datasheet.pdf | |
![]() | FFD25US-1024-X-P80 | MEMORY CARD FLASH 1GB | datasheet.pdf | |
| IS42S32800D-75ETL | IC SDRAM 256MBIT 133MHZ 86TSOP | datasheet.pdf | ||
![]() | 512-26-4400-SV-0007F | MODULAR CBL STR 7' REVERSED | datasheet.pdf | |
![]() | KPSE07E14-12SX | CONN RCPT 12POS JAM NUT SKT | datasheet.pdf | |
![]() | XC7VX485T-L2FFG1157E | IC FPGA 600 I/O 1157FCBGA | datasheet.pdf | |
![]() | 8978580000 | CONFIGURATION INTERFACE | datasheet.pdf | |
![]() | 0444720653 | MINIFIT HCS DR V/PEGS V-0 /DH 6C | datasheet.pdf | |
![]() | PA4304.184NLT | FIXED IND 180UH 900MA 290 MOHM | datasheet.pdf | |
![]() | 3240975 | WP-EC TPE HF 13 0 BK | datasheet.pdf | |
![]() | BFC238650224 | CAP FILM 220 NF 10% 1600VDC RAD | datasheet.pdf | |
![]() | TVS01RF-21-11P | TV 11C 11#12 PIN RECP | datasheet.pdf |