Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-A3P1000-1FGG484I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Gold to Palladium Coated Copper Wire Chg 5/Nov/2015 | |
Standard Package | 40 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | ProASIC3 | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | - | |
Total RAM Bits | 147456 | |
Number of I/O | 300 | |
Number of Gates | 1000000 | |
Voltage - Supply | 1.425 V ~ 1.575 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 484-BGA | |
Supplier Device Package | 484-FPBGA (23x23) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | A3P1000-1FGG484I | |
Related Links | A3P1000-, A3P1000-1FGG484I Datasheet, Microsemi SoC Distributor |
![]() | FQPF5N40 | MOSFET N-CH 400V 3A TO-220F | datasheet.pdf | |
![]() | EDM450AGSC0 LFS | SWITCH TACT SPST-NO 0.05A 100V | datasheet.pdf | |
![]() | EBC05DREH-S13 | CONN EDGECARD 10POS .100 EXTEND | datasheet.pdf | |
![]() | CB2JB3R90 | RES 3.9 OHM 2W 5% CERAMIC WW | datasheet.pdf | |
![]() | R6021225HSYA | DIODE GEN PURP 1.2KV 250A DO205 | datasheet.pdf | |
![]() | CMF554K5000BEEA | RES 4.5K OHM 1/2W 0.1% AXIAL | datasheet.pdf | |
![]() | 0386001807 | Connector Barrier Block Strip 7 Circuit 0.250" (6.35mm) | datasheet.pdf | |
![]() | DDM24W7PNMB76 | DSUB 24W7 M SOD NMB .154MTG HO | datasheet.pdf | |
![]() | RFI25-9 | BNC JACK RFI CAP W/4" NYLN CHN | datasheet.pdf | |
![]() | AST3TQ-V-16.320MHZ-28-T2 | OSC VCTCXO 16.32MHZ LVCMOS SMD | datasheet.pdf | |
![]() | 0625003236 | RED LED | datasheet.pdf | |
![]() | SFR-1/4-0-SP-CS5007 | HEAT SHRINK TUBING | datasheet.pdf |