Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3P1000-2FGG484M | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Gold to Palladium Coated Copper Wire Chg 5/Nov/2015 | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 147456 | |
| Number of I/O | 300 | |
| Number of Gates | 1000000 | |
| Voltage - Supply | 1.14 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -55°C ~ 125°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3P1000-2FGG484M | |
| Related Links | A3P1000-, A3P1000-2FGG484M Datasheet, Microsemi SoC Distributor | |
![]() | CP00054R700JB14 | RES 4.7 OHM 5% 5W WIREWOUND AXL | datasheet.pdf | |
![]() | ASC30DRAS | CONN EDGECARD 60POS .100 R/A DIP | datasheet.pdf | |
![]() | IDT70P3307S233RMI | IC SRAM 18MBIT 233MHZ 576FCBGA | datasheet.pdf | |
| 1-1437536-3 | CONN IC DIP SOCKET 18POS GOLD | datasheet.pdf | ||
| IS43LR16800F-6BLI | IC DDR SDRAM 128MBIT 60FBGA | datasheet.pdf | ||
![]() | VE-2WY-MW-F1 | CONVERTER MOD DC/DC 3.3V 66W | datasheet.pdf | |
![]() | VE-2N1-MX-B1 | CONVERTER MOD DC/DC 12V 75W | datasheet.pdf | |
![]() | DJT16F25-24HN | CONN PLUG 24POS STRGHT W/PINS | datasheet.pdf | |
![]() | 27-0518-10H | CONN SOCKET SIP 27POS GOLD | datasheet.pdf | |
| UMT1A330MDD1TP | CAP ALUM 33UF 20% 10V RADIAL | datasheet.pdf | ||
![]() | ATS-14E-55-C2-R0 | HEATSINK 35X35X10MM L-TAB T766 | datasheet.pdf | |
![]() | CN0967C18A08P8-000 | 26500 8C 8#12 P TH RECP AN LC | datasheet.pdf |