Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-A3P250-FGG256T | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASIC3 | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 36864 | |
| Number of I/O | 157 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | A3P250-FGG256T | |
| Related Links | A3P250-, A3P250-FGG256T Datasheet, Microsemi SoC Distributor | |
![]() | 116-93-640-41-008000 | CONN IC DIP SOCKET 40POS GOLD | datasheet.pdf | |
![]() | CRCW06035M36FKEA | RES SMD 5.36M OHM 1% 1/10W 0603 | datasheet.pdf | |
![]() | GSM15DTMT-S189 | CONN EDGECARD 30POS R/A .156 SLD | datasheet.pdf | |
![]() | MGA-31489-TR1G | IC HIGH GAIN DRVR 0.1W AMP SO89 | datasheet.pdf | |
![]() | RN50C4872FBSL | RES 48.7K OHM 1/20W 1% AXIAL | datasheet.pdf | |
![]() | RN55C2494BB14 | RES 2.49M OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | 097-0013-16 | CONTACT SKT CRIMP 16-20AWG GOLD | datasheet.pdf | |
![]() | CMF651M5800FHBF | RES 1.58M OHM 1.5W 1% AXIAL | datasheet.pdf | |
![]() | ATS-06E-65-C2-R0 | HEATSINK 40X40X30MM L-TAB T766 | datasheet.pdf | |
![]() | AIUR-16-5R6K | FIXED IND 5.6UH 1.3A 27 MOHM TH | datasheet.pdf | |
![]() | F6W1.75WH10 | F6 WOVEN WRAP 1 3/4 WH 10' | datasheet.pdf | |
![]() | 583-3 | THERMAL BONDING FILM 3"X60YD | datasheet.pdf |