Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-A3P600-FGG484 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Design/Specification | Gold to Palladium Coated Copper Wire Chg 5/Nov/2015 | |
Standard Package | 40 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | ProASIC3 | |
Number of LABs/CLBs | - | |
Number of Logic Elements/Cells | - | |
Total RAM Bits | 110592 | |
Number of I/O | 235 | |
Number of Gates | 600000 | |
Voltage - Supply | 1.425 V ~ 1.575 V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 70°C | |
Package / Case | 484-BGA | |
Supplier Device Package | 484-FPBGA (23x23) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | A3P600-FGG484 | |
Related Links | A3P600, A3P600-FGG484 Datasheet, Microsemi SoC Distributor |
![]() | H4BBT-10112-R1 | JUMPER-H9992TR/A3047R/H9992TR12" | datasheet.pdf | |
![]() | 23-6337-0027 | SOLDER RA FLUX 21AWG 63/37 .5LB | datasheet.pdf | |
![]() | CRA04P08362R0JTD | RES ARRAY 4 RES 62 OHM 0804 | datasheet.pdf | |
![]() | LP2985-30DBVRG4 | IC REG LDO 3V 0.15A SOT23-5 | datasheet.pdf | |
![]() | 5NS332KRJCA | CAP CER 3300PF 2KV Y5V RADIAL | datasheet.pdf | |
![]() | TNPW2512182KBEEG | RES SMD 182K OHM 0.1% 1/2W 2512 | datasheet.pdf | |
![]() | 1624309-1 | RES SMD 68 OHM 1% 2.5W 4823 | datasheet.pdf | |
![]() | PREC019SAEN-RC | CONN HEADER .100" SNGL STR 19POS | datasheet.pdf | |
![]() | CMF5545K300DHBF | RES 45.3K OHM 1/2W .5% AXIAL | datasheet.pdf | |
![]() | RBC28HETH | CONN EDGECARD .100" 28POS THRUHL | datasheet.pdf | |
![]() | MKP385568085JYP2T0 | CAP FILM 6.8UF 5% 850VDC AXIAL | datasheet.pdf | |
![]() | D38999/26MD5PN-U | CONN HSG PLUG STRGHT 5POS PIN | datasheet.pdf |