Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AFS090-FGG256I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | DDR Frequency 25/Jan/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Fusion® | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 27648 | |
| Number of I/O | 75 | |
| Number of Gates | 90000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AFS090-FGG256I | |
| Related Links | AFS090-, AFS090-FGG256I Datasheet, Microsemi SoC Distributor | |
![]() | RG1005N-7320-C-T10 | RES SMD 732 OHM 0.25% 1/16W 0402 | datasheet.pdf | |
![]() | 6-1879258-5 | RES SMD 909 OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | RNC50J70R6BSRE6 | RES 70.6 OHM 1/10W .1% AXIAL | datasheet.pdf | |
![]() | RER45F4990PCSL | RES CHAS MNT 499 OHM 1% 10W | datasheet.pdf | |
![]() | EKXJ451ELL390MM20S | CAP ALUM 39UF 20% 450V RADIAL | datasheet.pdf | |
![]() | CMF6075K000CHEK | RES 75K OHM 1W 0.25% AXIAL | datasheet.pdf | |
![]() | T530X108M2R5ATE005 | CAP TANT POLY 1000UF 2.5V 2917 | datasheet.pdf | |
![]() | ATS-01A-05-C1-R0 | HEATSINK 40X40X25MM XCUT | datasheet.pdf | |
![]() | 2420/30 BK-100 | ULTRA-FLEX FEP 30 AWG 100 FT BK | datasheet.pdf | |
![]() | MS4800B-20-0760 | SAFETY LIGHT CURTAIN | datasheet.pdf | |
![]() | VJ0402D120KXXAJ | CAP CER 12PF 25V NP0 0402 | datasheet.pdf | |
![]() | MHQ1005P62NJT000 | FIXED IND 62NH 180MA 1.9 OHM SMD | datasheet.pdf |