Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AFS1500-1FGG484 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | DDR Frequency 25/Jan/2013 | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Fusion® | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 276480 | |
| Number of I/O | 223 | |
| Number of Gates | 1500000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 484-BGA | |
| Supplier Device Package | 484-FPBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AFS1500-1FGG484 | |
| Related Links | AFS1500, AFS1500-1FGG484 Datasheet, Microsemi SoC Distributor | |
![]() | 912393 | INTERFACE CBL DSUB FEMALE W/SCRW | datasheet.pdf | |
![]() | TNPW2010383RBEEF | RES SMD 383 OHM 0.1% 0.4W 2010 | datasheet.pdf | |
![]() | CB3JB62R0 | RES 62 OHM 3W 5% CERAMIC WW | datasheet.pdf | |
![]() | 2814537 | 3 WAY ISOLATING AMP 4-20MA | datasheet.pdf | |
![]() | 0152660185 | PREMO-FLEX LGT 51 TYPEA 18POS | datasheet.pdf | |
![]() | 0629000903 | PUNCH COVER | datasheet.pdf | |
![]() | MAX8939EWV+T | IC PWR MGMT HANDSETS 30WLP | datasheet.pdf | |
![]() | C947U152MZWDBAWL40 | CAP CER 1500PF 440VAC Y5U RADIAL | datasheet.pdf | |
![]() | 1892C SL001 | CABLE 2COND 12AWG SLATE 1000' | datasheet.pdf | |
![]() | 67999-452HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | 74LVC2G14FX4-7 | IC GATE INV SCHM X2-DFN1409-6 | datasheet.pdf | |
![]() | JP503AS | COUPLER HYBRID 2.0-2.3GHZ | datasheet.pdf |