Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AFS250-2FGG256 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | DDR Frequency 25/Jan/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Fusion® | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 36864 | |
| Number of I/O | 114 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AFS250-2FGG256 | |
| Related Links | AFS250-, AFS250-2FGG256 Datasheet, Microsemi SoC Distributor | |
![]() | 323912 | CONN RING 22-26 AWG #2 YEL PIDG | datasheet.pdf | |
![]() | GEC13DRXN-S734 | CONN EDGECARD 26POS DIP .100 SLD | datasheet.pdf | |
![]() | PRG18BC2R2MM1RB | THERMISTOR PTC 2.2 OHM 0603 SMD | datasheet.pdf | |
![]() | XS3F-M8PUR3A10M | SENSOR I/O CONNECTOR | datasheet.pdf | |
![]() | RNC50J3203BSRSL | RES 320K OHM 1/10W .1% AXIAL | datasheet.pdf | |
![]() | RNC55J3832FRRSL | RES 38.3K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | 83272069 | SWITCH SNAP ACTION 5A SPDT | datasheet.pdf | |
![]() | 0387506615 | Connector Barrier Block Strip 15 Circuit 0.375" (9.53mm) | datasheet.pdf | |
![]() | 3008180 | CONN TERM BLOCK | datasheet.pdf | |
![]() | ATS-17F-167-C1-R0 | HEATSINK 25X25X20MM R-TAB | datasheet.pdf | |
![]() | MPZ1005S121ET000 | FERRITE CHIP BEAD | datasheet.pdf | |
![]() | D38999/24MD35JB-LC | CONN HSG RCPT JAM NUT 37POS SKT | datasheet.pdf |