Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-AFS250-2FGG256 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | DDR Frequency 25/Jan/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Fusion® | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 36864 | |
| Number of I/O | 114 | |
| Number of Gates | 250000 | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | AFS250-2FGG256 | |
| Related Links | AFS250-, AFS250-2FGG256 Datasheet, Microsemi SoC Distributor | |
![]() | H3AAT-10106-S8 | JUMPER-H1506TR/A3048S/H1506TR 6" | datasheet.pdf | |
![]() | 2036-07-C2 | GDT 75V 20% 10KA THROUGH HOLE | datasheet.pdf | |
![]() | RG2012N-4642-D-T5 | RES SMD 46.4K OHM 0.5% 1/8W 0805 | datasheet.pdf | |
![]() | LM3S6618-IBZ50-A2T | IC MCU 32BIT 128KB FLASH 108BGA | datasheet.pdf | |
![]() | 1879452-2 | RES CHAS MNT 1.2 OHM 5% 750W | datasheet.pdf | |
![]() | VE-B52-MV | CONVERTER MOD DC/DC 15V 150W | datasheet.pdf | |
![]() | VI-2TF-CX-F2 | CONVERTER MOD DC/DC 72V 75W | datasheet.pdf | |
![]() | DTS26W25-61SB | CONN PLUG 61POS STRGHT W/SKT | datasheet.pdf | |
![]() | SET2LBKGNRDAU0A | SWITCH PUSH SPDT 0.01A 24V | datasheet.pdf | |
![]() | RJHSE538NA1 | RJ45 RA SHIELDED WITH LED | datasheet.pdf | |
![]() | TNPW120610K1BEEA | RES SMD 10.1K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | MAL211827151E3 | 150UF 40V 10X18MM 125C 4000H | datasheet.pdf |