Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-AM1806BZCED4 | |
Lead Free Status / RoHS Status | Lead free / RoHS compliant by exemption | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Obsolescence/ EOL | Freon/Netra/SubArtic EOL 06/Oct/2015 Freon/Netra/SubArtic EOL Update 4/Nov/2015 | |
PCN Design/Specification | Hybrid Au/Cu Wire Bond Flow 08/Apr/2014 Multiple Changes Revision B 23/Jun/2014 | |
Manufacturer Product Page | AM1806BZCED4 Specifications | |
Standard Package | 160 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Series | Sitara™ | |
Packaging | Tray | |
Core Processor | ARM926EJ-S | |
Number of Cores/Bus Width | 1 Core, 32-Bit | |
Speed | 456MHz | |
Co-Processors/DSP | System Control; CP15 | |
RAM Controllers | LPDDR, DDR2 | |
Graphics Acceleration | No | |
Display & Interface Controllers | LCD | |
Ethernet | - | |
SATA | - | |
USB | USB 2.0 + PHY (1) | |
Voltage - I/O | 1.8V, 3.3V | |
Operating Temperature | -40°C ~ 90°C | |
Security Features | - | |
Package / Case | 361-LFBGA | |
Supplier Device Package | 361-NFBGA (13x13) | |
Additional Interfaces | I²C, McASP, McBSP, SPI, MMC/SD, UART | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | AM1806BZCED4 | |
Related Links | AM1806, AM1806BZCED4 Datasheet, Texas Instruments Distributor |
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