Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-AM3352ZCE27 | |
Lead Free Status / RoHS Status | Lead free / RoHS compliant by exemption | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Microcontrollers: SYS/BIOS: Introduction to SYS/BIOS Threading | |
Featured Product | Create your power design now with TI’s WEBENCH® Designer | |
PCN Obsolescence/ EOL | Freon/Netra/SubArtic EOL 06/Oct/2015 Freon/Netra/SubArtic EOL Update 4/Nov/2015 | |
Manufacturer Product Page | AM3352ZCE27 Specifications | |
Standard Package | 160 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - Microprocessors | |
Series | Sitara™ | |
Packaging | Tray | |
Core Processor | ARM® Cortex®-A8 | |
Number of Cores/Bus Width | 1 Core, 32-Bit | |
Speed | 275MHz | |
Co-Processors/DSP | Multimedia; NEON™ SIMD | |
RAM Controllers | LPDDR, DDR2, DDR3, DDR3L | |
Graphics Acceleration | Yes | |
Display & Interface Controllers | LCD, Touchscreen | |
Ethernet | 10/100/1000 Mbps (2) | |
SATA | - | |
USB | USB 2.0 + PHY (2) | |
Voltage - I/O | 1.8V, 3.3V | |
Operating Temperature | 0°C ~ 90°C | |
Security Features | Cryptography, Random Number Generator | |
Package / Case | 298-LFBGA | |
Supplier Device Package | 298-NFBGA (13x13) | |
Additional Interfaces | CAN, I²C, McASP, McSPI, MMC/SD/SDIO, UART | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | AM3352ZCE27 | |
Related Links | AM335, AM3352ZCE27 Datasheet, Texas Instruments Distributor |
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