Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-APA150-FGG256 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASICPLUS | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 36864 | |
| Number of I/O | 186 | |
| Number of Gates | 150000 | |
| Voltage - Supply | 2.3 V ~ 2.7 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | APA150-FGG256 | |
| Related Links | APA150, APA150-FGG256 Datasheet, Microsemi SoC Distributor | |
![]() | PIC16C715-20/SO | IC MCU 8BIT 3.5KB OTP 18SOIC | datasheet.pdf | |
![]() | GBE20DHHR | CONN EDGECARD 40POS 1MM DIP SLD | datasheet.pdf | |
![]() | 8-1879692-8 | RES 80.6 OHM 1/4W 0.1% AXIAL | datasheet.pdf | |
![]() | R5F104LJAFA#V0 | IC MCU 16BIT 256KB FLASH 64LQFP | datasheet.pdf | |
![]() | 3-2176089-8 | RES SMD 27.4K OHM 0.1% 1/6W 0603 | datasheet.pdf | |
| 503GBB-ADAG | OSC PROG 8NS 30PPM 2X2.5MM | datasheet.pdf | ||
![]() | 4470-32F | FIXED IND 390UH 180MA 15.5 OHM | datasheet.pdf | |
![]() | LCD2-12-Q | LUG COPPER 2 HOLE | datasheet.pdf | |
![]() | ATS-11E-31-C3-R0 | HEATSINK 57.9X36.83X5.84MM T412 | datasheet.pdf | |
![]() | D38999/26JC8PD-LC | CONN PLUG 8POS STRGHT W/PINS | datasheet.pdf | |
![]() | XC4062XL-3HQ240N | XILINX IC XC4062XL-3HQ240N In stock | datasheet.pdf | |
![]() | WPC03R24S05LC | Capacitors Inductors Filters... | datasheet.pdf |