Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-APA300-BGG456 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 24 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASICPLUS | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 73728 | |
| Number of I/O | 290 | |
| Number of Gates | 300000 | |
| Voltage - Supply | 2.3 V ~ 2.7 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 456-BBGA | |
| Supplier Device Package | 456-PBGA (35x35) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | APA300-BGG456 | |
| Related Links | APA300, APA300-BGG456 Datasheet, Microsemi SoC Distributor | |
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