Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-APA300-FGG144 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 160 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASICPLUS | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 73728 | |
| Number of I/O | 100 | |
| Number of Gates | 300000 | |
| Voltage - Supply | 2.3 V ~ 2.7 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 144-LBGA | |
| Supplier Device Package | 144-FPBGA (13x13) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | APA300-FGG144 | |
| Related Links | APA300, APA300-FGG144 Datasheet, Microsemi SoC Distributor | |
![]() | PBC09SFDN | CONN HEADER .100 SINGL STR 9POS | datasheet.pdf | |
![]() | 1210-183J | FIXED IND 18UH 237MA 3.3 OHM SMD | datasheet.pdf | |
![]() | 4-1579001-1 | ERGO DIE MCP 1 2 LL | datasheet.pdf | |
![]() | P1171.684NLT | FIXED IND 680UH 570MA 1.2 OHM | datasheet.pdf | |
![]() | M1AFS600-PQG208 | IC FPGA 95 I/O 208PQFP | datasheet.pdf | |
![]() | 1PB557 | SWITCH LIMIT PB PNL MT SPDT 5A | datasheet.pdf | |
![]() | 2EZ17D10/TR8 | DIODE ZENER 17V 2W DO204AL | datasheet.pdf | |
![]() | MS3474L14-9BY | CONN HSG RCPT 9POS JAM NUT SKT | datasheet.pdf | |
![]() | 91910-21209 | CONN HEADER 9POS 1MM VERT SMD | datasheet.pdf | |
![]() | TO22015100J0G | 500 TB RIS CLA 180 SOLID | datasheet.pdf | |
![]() | TX40AB00-2006 | CONN BACKSHELL ADPT SZ 21G OLIVE | datasheet.pdf | |
![]() | D38999/24FE35HE-LC | CONN HSG RCPT JAM NUT 55POS PIN | datasheet.pdf |