Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-APA300-FGG256I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | Copper Wire Rev. C 24/Jun/2013 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASICPLUS | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 73728 | |
| Number of I/O | 186 | |
| Number of Gates | 300000 | |
| Voltage - Supply | 2.3 V ~ 2.7 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FPBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | APA300-FGG256I | |
| Related Links | APA300-, APA300-FGG256I Datasheet, Microsemi SoC Distributor | |
![]() | SN74BCT245DBR | IC BUS TRANSCEIVER 8BIT 20SSOP | datasheet.pdf | |
![]() | RCM25DRSS | CONN EDGECARD 50POS DIP .156 SLD | datasheet.pdf | |
![]() | GRM42A5C3F270JW01L | CAP CER 27PF 3.15KV NP0 1808 | datasheet.pdf | |
| NS12555T681MN | FIXED IND 680UH 720MA 912 MOHM | datasheet.pdf | ||
![]() | 1090AX1-28V | INDICATOR INCAND RED PANEL MNT | datasheet.pdf | |
![]() | RLR20C3301GPB14 | RES 3.3K OHM 2% 1/2W AXIAL | datasheet.pdf | |
![]() | RN60D56R2FB14 | RES 56.2 OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | M55342E12B102BRWS | RES SMD 102K OHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | 2256-14J | FIXED IND 12UH 2.24A 79 MOHM TH | datasheet.pdf | |
![]() | TNPW0603243RBEEC | RES SMD 243 OHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | 101A10169X | CONN 13POS M 5MM DIN41617 | datasheet.pdf | |
![]() | D38999/26MF35HN-LC | CONN HSG PLUG STRGHT 66POS PIN | datasheet.pdf |