Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-APA750-FG676 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | ProASICPLUS | |
| Number of LABs/CLBs | - | |
| Number of Logic Elements/Cells | - | |
| Total RAM Bits | 147456 | |
| Number of I/O | 454 | |
| Number of Gates | 750000 | |
| Voltage - Supply | 2.3 V ~ 2.7 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 70°C | |
| Package / Case | 676-BGA | |
| Supplier Device Package | 676-FBGA (27x27) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | APA750-FG676 | |
| Related Links | APA750, APA750-FG676 Datasheet, Microsemi SoC Distributor | |
![]() | DQ1260-4R7M | FIXED IND 4.7UH 10A 18 MOHM SMD | datasheet.pdf | |
![]() | OPA2683IDRG4 | IC OPAMP CFA 1.44GHZ 8SOIC | datasheet.pdf | |
![]() | RN55E9312FB14 | RES 93.1K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | ECK-THC471KB | CAP CER 470PF 250VAC Y5P 2-SMD | datasheet.pdf | |
![]() | CMF60512K00BEBF | RES 512K OHM 1W 0.1% AXIAL | datasheet.pdf | |
![]() | PT12135SL | FIXED IND 12MH 40MA 40 OHM TH | datasheet.pdf | |
![]() | M20-7831542 | Connector Receptacle 30 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | Y0075100R000A9L | RES 100 OHM 0.3W 0.05% RADIAL | datasheet.pdf | |
![]() | RCB70DYRN-S1355 | CONN CARD EXTEND .050" 70POS | datasheet.pdf | |
![]() | HT03008000J0G | 500 TB SPRING CLAMP 45D | datasheet.pdf | |
![]() | KH12155100J0G | 762 TB WIR PRO 180D | datasheet.pdf | |
![]() | CT2131-150-5 | LD 4MM STK P-P SILC .75 150CM GN | datasheet.pdf |