Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-APS1867064G-3BTMN | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Memory Cards, Modules | |
| Family | Solid State Drives (SSDs) | |
| Series | SFD18S6-M | |
| Memory Size | 64GB | |
| Memory Type | FLASH - NAND (MLC) | |
| Form Factor | 1.8" | |
| Speed - Read | 530MB/s | |
| Speed - Write | 145MB/s | |
| Voltage - Supply | 5V | |
| Type | SATA III | |
| Current - Max | - | |
| Operating Temperature | -25°C ~ 85°C | |
| Weight | 0.001 KG | |
| Size / Dimension | 54.00mm x 39.80mm x 4.00mm | |
| Application | Email for details | |
| Alternative Part (Replacement) | APS1867064G-3BTMN | |
| Related Links | APS18670, APS1867064G-3BTMN Datasheet, Apacer Memory America Distributor | |
| HCPL-2731#300 | OPTOISO 3.75KV 2CH DARL 8-DIP GW | datasheet.pdf | ||
![]() | ADUM1412BRWZ-RL | DGTL ISO 2.5KV GEN PURP 16SOIC | datasheet.pdf | |
![]() | RHC2512FT3K30 | RES SMD 3.3K OHM 1% 2W 2512 | datasheet.pdf | |
![]() | A22N-MR162 | LEFT-OFF-RIGHT | datasheet.pdf | |
![]() | 961421-9040804-AR | HEADER 21POS STR DUAL INSUL 1ROW | datasheet.pdf | |
![]() | ECW-H16203RHV | CAP FILM 0.02UF 3% 1.6KVDC RAD | datasheet.pdf | |
![]() | A22RL-20M-T2 | SWITCHES | datasheet.pdf | |
![]() | 1199720000 | BOX S STEEL 35.98"L X 24.02"W | datasheet.pdf | |
![]() | 131-3303-001 | SMB JACK STR RG316 | datasheet.pdf | |
![]() | ATS-10E-148-C1-R0 | HEATSINK 35X35X15MM L-TAB | datasheet.pdf | |
![]() | TVP00RK-13-32P-P2AD | HD 38999 32C 32#23 PIN RECP | datasheet.pdf | |
![]() | XCV300E-5FGG456I | IC FPGA 260 I/O 352MBGA | datasheet.pdf |