Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-ATSAM3S2AA-MUR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | Software Framework (ASF) Example of Use Studio Introduction to Software Framework (ASF) Studio Development Environment Overview Part 1 | |
| Design Resources | Development Tool Selector | |
| Featured Product | Atmel - SAM3S Series MCUs | |
| PCN Assembly/Origin | Wafer Foundry Transfer 27/Nov/2013 | |
| PCN Packaging | Tape and Reel Label Update 10/Feb/2015 | |
| PCN Other | MSL Update 26/Feb/2014 MSL Revision A 26/Mar/2014 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 1 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | SAM3S | |
| Packaging | Cut Tape (CT) | |
| Core Processor | ARM® Cortex®-M3 | |
| Core Size | 32-Bit | |
| Speed | 64MHz | |
| Connectivity | I²C, MMC, SPI, SSC, UART/USART, USB | |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | |
| Number of I/O | 34 | |
| Program Memory Size | 128KB (128K x 8) | |
| Program Memory Type | FLASH | |
| EEPROM Size | - | |
| RAM Size | 32K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.62 V ~ 3.6 V | |
| Data Converters | A/D 8x10/12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 48-VFQFN Exposed Pad | |
| Supplier Device Package | 48-QFN (7x7) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | ATSAM3S2AA-MUR | |
| Related Links | ATSAM3S, ATSAM3S2AA-MUR Datasheet, Atmel Distributor | |
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