Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-ATXMEGA64A3-MH | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | MCU Product Line Introduction XMEGA Introduction AVR XMEGA USB Connectivity Software Framework (ASF) Example of Use Studio Introduction to Software Framework (ASF) Studio Development Environment Overview Part 1 | |
| Design Resources | Development Tool Selector | |
| Featured Product | Atmel - AVR® XMEGA® LCD Peripheral | |
| PCN Design/Specification | Copper Bonding Wire Update 30/Jan/2015 | |
| PCN Other | MSL3 to MSL1 05/Apr/2013 MSL Update 26/Feb/2014 MSL Revision A 26/Mar/2014 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 260 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontrollers | |
| Series | AVR® XMEGA® A3 | |
| Packaging | Tray | |
| Core Processor | AVR | |
| Core Size | 8/16-Bit | |
| Speed | 32MHz | |
| Connectivity | I²C, IrDA, SPI, UART/USART | |
| Peripherals | Brown-out Detect/Reset, DMA, POR, PWM, WDT | |
| Number of I/O | 50 | |
| Program Memory Size | 64KB (32K x 16) | |
| Program Memory Type | FLASH | |
| EEPROM Size | 2K x 8 | |
| RAM Size | 4K x 8 | |
| Voltage - Supply (Vcc/Vdd) | 1.6 V ~ 3.6 V | |
| Data Converters | A/D 16x12b; D/A 2x12b | |
| Oscillator Type | Internal | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 64-VFQFN Exposed Pad | |
| Supplier Device Package | 64-QFN (9x9) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | ATXMEGA64A3-MH | |
| Related Links | ATXMEGA, ATXMEGA64A3-MH Datasheet, Atmel Distributor | |
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