Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-BBL-115-G-F | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Board-to-Board Connectors | |
Featured Product | Board-To-Board Interconnect Systems | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Rectangular - Board to Board Connectors - Headers, Male Pins | |
Series | BBL | |
Packaging | Bulk | |
Connector Type | Unshrouded | |
Number of Positions | 15 | |
Number of Positions Loaded | All | |
Pitch | 0.100" (2.54mm) | |
Number of Rows | 1 | |
Row Spacing | - | |
Height Stacking (Mating) | - | |
Molding Height Above Board | 0.085" (2.16mm) | |
Contact Mating Length | 0.122" (3.10mm) | |
Mounting Type | Through Hole | |
Termination | Solder | |
Contact Finish | Gold | |
Contact Finish Thickness | 20µin (0.51µm) | |
Features | - | |
Color | Black | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | BBL-115-G-F | |
Related Links | BBL-1, BBL-115-G-F Datasheet, Samtec, Inc. Distributor |
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