Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-BP100-0.005-00-1010 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
MSDS Material Safety Datasheet | Bond-Ply 100 MSDS | |
RoHS Information | Bond-Ply(R) RoHS Cert | |
Standard Package | 100 | |
Category | Fans, Thermal Management | |
Family | Thermal - Pads, Sheets | |
Series | Bond-Ply® 100 | |
Usage | Sheet | |
Shape | Square | |
Outline | 254.00mm x 254.00mm | |
Thickness | 0.0050" (0.127mm) | |
Material | Polyimide | |
Adhesive | Adhesive - Both Sides | |
Backing, Carrier | Fiberglass | |
Color | White | |
Thermal Resistivity | 0.52°C/W | |
Thermal Conductivity | 0.8 W/m-K | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | BP100-0.005-00-1010 | |
Related Links | BP100-0.0, BP100-0.005-00-1010 Datasheet, Bergquist Distributor |
![]() | PIC16C711T-04I/SO | IC MCU 8BIT 1.75KB OTP 18SOIC | datasheet.pdf | |
![]() | DG390ACWE+ | IC SWITCH DUAL SPDT 16SOIC | datasheet.pdf | |
![]() | 95278-101A26LF | BERGSTIK | datasheet.pdf | |
![]() | 5-1622796-8 | RES 14.3K OHM 1/4W 0.1% AXIAL | datasheet.pdf | |
![]() | ELLH03290 | TERM BLOCK HDR 3POS VERT 10.16MM | datasheet.pdf | |
![]() | 89H32NT8BG2ZBHLG | IC PCI SW 32LANE 8PORT 484BGA | datasheet.pdf | |
![]() | LQM21NN3R3K10L | FIXED IND 3.3UH 30MA 800 MOHM | datasheet.pdf | |
![]() | MP6-2U-2U-4QE-00 | MP CONFIGURABLE POWER SUPPLY | datasheet.pdf | |
![]() | 0430451426 | MICROFIT 3.0 V TH /CLIP DR 30AU | datasheet.pdf | |
![]() | 801-87-019-10-143101 | Connector Socket 19 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
![]() | ATS-P1-129-C1-R0 | HEATSINK 60X60X10MM XCUT | datasheet.pdf | |
![]() | V20PL60-M3/87A | DIODE SCHOTTKY | datasheet.pdf |