Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-BR25H080FJ-WCE2 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Product Training Modules | EEPROM Memory Solutions | |
| Standard Package | 2,500 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | Automotive, AEC-Q100 | |
| Packaging | Tape & Reel (TR) | |
| Format - Memory | EEPROMs - Serial | |
| Memory Type | EEPROM | |
| Memory Size | 8K (1K x 8) | |
| Speed | 5MHz | |
| Interface | SPI Serial | |
| Voltage - Supply | 2.5 V ~ 5.5 V | |
| Operating Temperature | -40°C ~ 125°C | |
| Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
| Supplier Device Package | 8-SOP-J | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | BR25H080FJ-WCE2 | |
| Related Links | BR25H08, BR25H080FJ-WCE2 Datasheet, Rohm Semiconductor Distributor | |
![]() | 9T06031A15R4CAHFT | RES SMD 15.4OHM 0.25% 1/10W 0603 | datasheet.pdf | |
![]() | MC56F8366VFVE | IC DSC 16BIT 512KB FLASH 144LQFP | datasheet.pdf | |
![]() | MCR10EZHF4751 | RES SMD 4.75K OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | GCA24DTMD | CONN EDGECARD 48POS R/A .125 SLD | datasheet.pdf | |
![]() | 54202-G08-03 | CONN SMT 30 GOLD | datasheet.pdf | |
![]() | 0011404032 | 8303-1 INSULATION PUNCH | datasheet.pdf | |
![]() | RNC50J9872BSB14 | RES 98.7K OHM 1/10W .1% AXIAL | datasheet.pdf | |
![]() | MCR10ERTF1823 | RES SMD 182K OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | 56SP30-01-2-02N | SWITCH ROTARY DPDT | datasheet.pdf | |
![]() | Y404510K0000T0W | RES SMD 10K OHM 0.01% 1/20W 0505 | datasheet.pdf | |
![]() | 66925-550LF | Connector Receptacle 100 Position 0.100" (2.54mm) Gold Through Hole, Right Angle | datasheet.pdf | |
![]() | BACC63CC20-25P8H | 26500 19#20 6#12 P BY RECP LC | datasheet.pdf |