Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-CENGPXA270-416-10-550HIR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - Microcontroller or Microprocessor Modules | |
| Series | - | |
| Module/Board Type | MCU Core | |
| Core Processor | PXA270 | |
| Co-Processor | - | |
| Speed | 416MHz | |
| Flash Size | 64MB | |
| RAM Size | 64MB | |
| Connector Type | SO-DIMM-144 | |
| Size / Dimension | 2.37" x 2.67" (60.2mm x 67.8mm) | |
| Operating Temperature | -40°C ~ 85°C | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | CENGPXA270-416-10-550HIR | |
| Related Links | CENGPXA270-4, CENGPXA270-416-10-550HIR Datasheet, Logic PD, Inc. Distributor | |
![]() | BK/GDB-5A | FUSE GLASS 5A 250VAC 5X20MM | datasheet.pdf | |
![]() | DT0703-1R0M | FIXED IND 1UH 2A 45 MOHM SMD | datasheet.pdf | |
![]() | 9T12062A3571BAHFT | RES SMD 3.57K OHM 0.1% 1/8W 1206 | datasheet.pdf | |
![]() | T0054442399 | TIP SOLDER ROUND .20 X 25 | datasheet.pdf | |
![]() | ERJ-T06J244V | RES SMD 240K OHM 5% 1/4W 0805 | datasheet.pdf | |
![]() | RN73C2A1K13BTD | RES SMD 1.13KOHM 0.1% 1/10W 0805 | datasheet.pdf | |
![]() | RWR81S40R2BSB12 | RES 40.2 OHM 1W 0.1% WW AXIAL | datasheet.pdf | |
![]() | RWR78S2R15BRB12 | RES 2.15 OHM 10W 0.1% WW AXIAL | datasheet.pdf | |
![]() | 61500088036 | SURFACE FB BELT 3X132" A VFN | datasheet.pdf | |
![]() | 5451132 | TERM BLOCK PLUG | datasheet.pdf | |
![]() | LGJ2E181MELZ20 | CAP ALUM 180UF 20% 250V SNAP | datasheet.pdf | |
![]() | TPS24742RGET | IC HOT SWAP ORING CTLR 24VQFN | datasheet.pdf |