Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-CP001010R00JE14 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 100 | |
| Category | Resistors | |
| Family | Through Hole Resistors | |
| Series | CP | |
| Packaging | Bulk | |
| Resistance (Ohms) | 10 | |
| Tolerance | ±5% | |
| Power (Watts) | 10W | |
| Composition | Wirewound | |
| Features | Flame Proof, Safety | |
| Temperature Coefficient | ±300ppm/°C | |
| Operating Temperature | -65°C ~ 275°C | |
| Package / Case | Axial | |
| Supplier Device Package | Axial | |
| Size / Dimension | 1.875" L x 0.375" W (47.62mm x 9.52mm) | |
| Height | - | |
| Number of Terminations | 2 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | CP001010R00JE14 | |
| Related Links | CP00101, CP001010R00JE14 Datasheet, Vishay/Dale Distributor | |
![]() | B32924A2105K | CAP FILM 1UF 10% 305VAC RADIAL | datasheet.pdf | |
![]() | 74HC365PW,118 | IC BUFF DVR TRI-ST HEX 16TSSOP | datasheet.pdf | |
![]() | IMC1812EB3R3J | FIXED IND 3.3UH 355MA 800 MOHM | datasheet.pdf | |
![]() | C4SMH-RJS-CR0T0BB1 | LED RED CLEAR 4MM OVAL T/H | datasheet.pdf | |
![]() | 61500153293 | PRODUCTION CLEAN&FINISH DISC 6" | datasheet.pdf | |
![]() | EPF10K50SQC240-2 | IC FPGA 189 I/O 240QFP | datasheet.pdf | |
![]() | 93254-116HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | ATS-14F-157-C3-R0 | HEATSINK 40X40X30MM L-TAB T412 | datasheet.pdf | |
![]() | L717SDAH15POL2GC309 | D-Sub Connector Plug, Male Pins 15 Position Through Hole Solder | datasheet.pdf | |
![]() | 20020007-H031AA1LF | TERM BLOCK | datasheet.pdf | |
![]() | 7B27-J-11-2 | Isolated Thermocouple Input IC | datasheet.pdf | |
![]() | ADP3203JRU-10-RL | 2-Phase IMVP-II & IMVP-III Core Controller for Mobile CPUs IC | datasheet.pdf |