Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-CSD87352Q5D | |
Lead Free Status / RoHS Status | Contains lead / RoHS compliant by exemption | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | NexFET MOSFET Technology | |
Video File | PowerStack™ Packaging Technology Overview | |
PCN Design/Specification | Qualification Revision A 01/Jul/2014 | |
PCN Assembly/Origin | Qualification Wire Bond 27/May/2014 Assembly/Test Site Addition 10/Aug/2015 | |
PCN Packaging | MSL1 Bubble Bag Conversion 24/Sep/2013 | |
Manufacturer Product Page | CSD87352Q5D Specifications | |
Standard Package | 1 | |
Category | Discrete Semiconductor Products | |
Family | FETs - Arrays | |
Series | NexFET™ | |
Packaging | Cut Tape (CT) | |
FET Type | 2 N-Channel (Dual) | |
FET Feature | Logic Level Gate | |
Drain to Source Voltage (Vdss) | 30V | |
Current - Continuous Drain (Id) @ 25°C | 25A | |
Rds On (Max) @ Id, Vgs | - | |
Vgs(th) (Max) @ Id | 1.15V @ 250µA | |
Gate Charge (Qg) @ Vgs | 12.5nC @ 4.5V | |
Input Capacitance (Ciss) @ Vds | 1800pF @ 15V | |
Power - Max | 8.5W | |
Mounting Type | Surface Mount | |
Package / Case | 8-LDFN Exposed Pad | |
Supplier Device Package | 8-SON (5x6) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | CSD87352Q5D | |
Related Links | CSD87, CSD87352Q5D Datasheet, Texas Instruments Distributor |
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