Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-CY62147G30-45BVXI | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Mfg Application Notes | Mitigating Single-Event Upsets Using 65-nm Asynchronous SRAM | |
| Standard Package | 480 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | MoBL® | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | SRAM - Asynchronous | |
| Memory Size | 4M (256K x 16) | |
| Speed | 45ns | |
| Interface | Parallel | |
| Voltage - Supply | 2.2 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 48-VFBGA | |
| Supplier Device Package | 48-VFBGA (6x8) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | CY62147G30-45BVXI | |
| Related Links | CY62147G, CY62147G30-45BVXI Datasheet, Cypress Semiconductor Distributor | |
![]() | RC0805FR-0710R2L | RES SMD 10.2 OHM 1% 1/8W 0805 | datasheet.pdf | |
![]() | 5227161-1 | CONN BNC JACK R/A 50 OHM PCB | datasheet.pdf | |
![]() | RT1206BRD073K9L | RES SMD 3.9K OHM 0.1% 1/4W 1206 | datasheet.pdf | |
![]() | ECW-F2W684JA | CAP FILM 0.68UF 5% 450VDC RADIAL | datasheet.pdf | |
![]() | VE-J6D-MY-B1 | CONVERTER MOD DC/DC 85V 50W | datasheet.pdf | |
![]() | RNC55H8061FPBSL | RES 8.06K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | 50YXF100MEFCT78X11.5 | CAP ALUM 100UF 20% 50V RADIAL | datasheet.pdf | |
![]() | EKMH251VND471MA25T | CAP ALUM 470UF 20% 250V SNAP | datasheet.pdf | |
![]() | 3EZ3.9D10/TR8 | DIODE ZENER 3.9V 3W DO204AL | datasheet.pdf | |
![]() | 19400240414 | CONN HOOD TOP ENTRY SZ24B M50 | datasheet.pdf | |
![]() | 950811 | BOX STEEL 19.69"L X 13.78"W | datasheet.pdf | |
![]() | ATS-16G-150-C2-R0 | HEATSINK 35X35X25MM L-TAB T766 | datasheet.pdf |