Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-CY62167DV30LL-55BVI | |
Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
PCN Assembly/Origin | GSMC Manufacture Merger 15/May/2014 | |
PCN Other | Multiple Updates 27/Mar/2015 Transition to 65-nanometer 24/Sep/2015 | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 210 | |
Category | Integrated Circuits (ICs) | |
Family | Memory | |
Series | MoBL® | |
Packaging | Tray | |
Format - Memory | RAM | |
Memory Type | SRAM - Asynchronous | |
Memory Size | 16M (2M x 8, 1M x 16) | |
Speed | 55ns | |
Interface | Parallel | |
Voltage - Supply | 2.2 V ~ 3.6 V | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 48-VFBGA | |
Supplier Device Package | 48-VFBGA (8x9.5) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | CY62167DV30LL-55BVI | |
Related Links | CY62167DV, CY62167DV30LL-55BVI Datasheet, Cypress Semiconductor Distributor |
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