Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-D38999/20MJ29SE-LC | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Circular Connectors - Housings | |
Series | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | D38999/20MJ29SE-LC | |
Related Links | D38999/20, D38999/20MJ29SE-LC Datasheet, Amphenol Aerospace Operations Distributor |
3339W-1-502 | TRIMMER 5K OHM 0.5W PC PIN | datasheet.pdf | ||
RT1206DRE07374RL | RES SMD 374 OHM 0.5% 1/4W 1206 | datasheet.pdf | ||
TRF3710EVM | EVAL MODULE FOR TRF3710 | datasheet.pdf | ||
950535-5002-AR | Connector Receptacle 35 Position 0.079" (2.00mm) Gold Through Hole, Right Angle | datasheet.pdf | ||
MAX19506ETM+ | IC ADC 8BIT 2CH 100MSPS 48TQFN | datasheet.pdf | ||
TNPU1206150RBZEN00 | RES SMD 150 OHM 0.1% 1/4W 1206 | datasheet.pdf | ||
M1A3P600L-1FG256I | IC FPGA 177 I/O 256FBGA | datasheet.pdf | ||
ATS-17G-113-C1-R0 | HEATSINK 40X40X10MM XCUT | datasheet.pdf | ||
ATS-12B-32-C1-R0 | HEATSINK 57.9X36.83X11.43MM | datasheet.pdf | ||
BZD27C16P-M-08 | DIODE ZENER 800MW SMF DO219-M | datasheet.pdf | ||
XCMECH-FF1760 | FF1760 MECHANICAL SAMPLE | datasheet.pdf | ||
5452923 | BCVP-381WF- 7 BK | datasheet.pdf |