Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-D38999/24MB2PN | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Circular Connectors | |
Series | * | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | D38999/24MB2PN | |
Related Links | D38999/, D38999/24MB2PN Datasheet, Amphenol Aerospace Operations Distributor |
![]() | AT8-DLA1 | DIN RAIL 35MMX7.5MM SLOTTED 1M | datasheet.pdf | |
![]() | ERJ-S1TJ333U | RES SMD 33K OHM 5% 1W 2512 | datasheet.pdf | |
![]() | 78576-236HLF | BERGSTIK II DR R/A WIDE BODY | datasheet.pdf | |
![]() | 72347-001 | 72347-1-SCA2 20P RECP CONN THRU | datasheet.pdf | |
![]() | CE201210-3N3J | FIXED IND 3.3NH 300MA 130 MOHM | datasheet.pdf | |
![]() | OSTTR221550 | TERM BLOCK RISING CLAMP 22POS | datasheet.pdf | |
![]() | RC0603J302CS | RES SMD 3K OHM 5% 1/20W 0201 | datasheet.pdf | |
![]() | 5AGXMB3G6F40C6N | IC FPGA 704 I/O 1517FBGA | datasheet.pdf | |
![]() | PHP00603E1761BBT1 | RES SMD 1.76K OHM 0.1% 3/8W 0603 | datasheet.pdf | |
![]() | CGE2E32H24ZB-16 | 121537-1028 | datasheet.pdf | |
![]() | ATS-CPX025025025-168-C3-R0 | HEATSINK 25X25X25MM R-TAB CP | datasheet.pdf | |
![]() | SF8V006S4BR1200 | CONN SIM CARD PUSH-PULL R/A SMD | datasheet.pdf |