Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-D38999/24WF18SN-LC | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | D38999/24WF18SN-LC | |
| Related Links | D38999/24, D38999/24WF18SN-LC Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | RG1608N-513-B-T5 | RES SMD 51K OHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | RSA44DTAT | CONN EDGECARD 88POS R/A .125 SLD | datasheet.pdf | |
![]() | SSTUG32865ET/S,518 | IC BUFFER 1.8V 28BIT 160-TFBGA | datasheet.pdf | |
![]() | RNC55J11R3FSBSL | RES 11.3 OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | RN70D1271FRSL | RES 1.27K OHM 3/4W 1% AXIAL | datasheet.pdf | |
![]() | D4JL-4NFG-D5 | D4JL-4NFG-D5 | datasheet.pdf | |
![]() | 5SGXEB5R3F43I4N | IC FPGA 600 I/O 1760FBGA | datasheet.pdf | |
| UFG1HR33MDM1TD | CAP ALUM 0.33UF 20% 50V RADIAL | datasheet.pdf | ||
![]() | SIT8209AI-21-33S-100.000000X | OSC MEMS 100.000MHZ SMD | datasheet.pdf | |
![]() | ATS-08A-71-C3-R0 | HEATSINK 45X45X30MM L-TAB T412 | datasheet.pdf | |
![]() | ATS-07C-53-C1-R0 | HEATSINK 30X30X30MM L-TAB | datasheet.pdf | |
![]() | L777DD50P | D-Sub Connector Plug, Male Pins 50 Position Free Hanging (In-Line) Solder | datasheet.pdf |