Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-D38999/26MF35BN | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | D38999/26MF35BN | |
| Related Links | D38999/, D38999/26MF35BN Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | XM2D-3701 | CONNECTOR | datasheet.pdf | |
![]() | HAE103MBACFGKR | CAP CER 10000PF 1KV RADIAL | datasheet.pdf | |
![]() | VE-26M-EU | CONVERTER MOD DC/DC 10V 200W | datasheet.pdf | |
![]() | RLR20C15R0FRRE6 | RES 15 OHM 1% 1/2W AXIAL | datasheet.pdf | |
![]() | 62R22-02-060S | OPTICAL ENCODER | datasheet.pdf | |
![]() | 5022-473F | FIXED IND 47UH 351MA 2.75 OHM | datasheet.pdf | |
![]() | 68798-133HLF | HEADER BERGSTIK R/A | datasheet.pdf | |
![]() | ATS-13B-80-C2-R0 | HEATSINK 30X30X15MM R-TAB T766 | datasheet.pdf | |
![]() | ATS-19C-209-C2-R0 | HEATSINK 70X70X10MM XCUT T766 | datasheet.pdf | |
![]() | CC3200MODR1M2AMOBR | IC MCU SIMPLELINK WI-FI MODULE | datasheet.pdf | |
![]() | IEGH66-1-62-1.00-A-01-V | CIR BRKR MAG-HYDR LEVER 1A | datasheet.pdf | |
![]() | HMC902LP3E | IC AMP MMIC GAAS LN 16QFN | datasheet.pdf |