Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-D38999/26MJ8AE | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Connectors, Interconnects | |
| Family | Circular Connectors - Housings | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | D38999/26MJ8AE | |
| Related Links | D38999/, D38999/26MJ8AE Datasheet, Amphenol Aerospace Operations Distributor | |
![]() | ACM06DTBH | CONN EDGECARD 12POS R/A .156 SLD | datasheet.pdf | |
| RSMF3JT2K20 | RES METAL OX 3W 2.2K OHM 5% AXL | datasheet.pdf | ||
| NRS5014T1R2NMGG | FIXED IND 1.2UH 2.4A 54 MOHM SMD | datasheet.pdf | ||
![]() | RN55C1073FBSL | RES 107K OHM 1/8W 1% AXIAL | datasheet.pdf | |
![]() | LM4051CIM3X-ADJ | IC VREF SHUNT ADJ SOT23-3 | datasheet.pdf | |
![]() | 995728 | FPA/C DI 1.5M 1771-IAD2WIRE | datasheet.pdf | |
![]() | 116-83-624-41-007101 | CONN IC DIP SOCKET 24POS GOLD | datasheet.pdf | |
![]() | MTSMC-H5-MI-IP | HSPA+ MODEM EMB CELL SERIAL | datasheet.pdf | |
![]() | ATS-08B-145-C2-R0 | HEATSINK 30X30X30MM L-TAB T766 | datasheet.pdf | |
![]() | ATS-11B-168-C3-R0 | HEATSINK 25X25X25MM R-TAB T412 | datasheet.pdf | |
![]() | BFC238346682 | CAP FILM 6.8NF 5% 1400VDC RAD | datasheet.pdf | |
![]() | ADM3101E | 3.3 V, Single Channel RS-232 Line Driver/Receiver IC | datasheet.pdf |